MaxLinear Intros MoCA 2.5 Chip

At the CableLabs Summer Conference in Keystone, CO, MaxLinear (NYSE:MXL) announced the MxL3710, an integrated circuit (IC) designed to ...

MaxLinear chips baked into Teamly HFC micronode
MaxLinear chips baked into Teamly HFC micronode

At the CableLabs Summer Conference in Keystone, CO, MaxLinear (NYSE:MXL) announced the MxL3710, an integrated circuit (IC) designed to support the multi-gigabit Multimedia over Coax Alliance (MoCA) 2.5 specification, which is intended to provide 2.5 Gbps of aggregate MAC throughput in home networking applications. MoCA 2.5 was first announced in April.

The CPE chip is designed to provide 2.5 Gbps of MAC throughput over a 16-node home network consisting of other MoCA 2.5 devices. Additionally, the MxL3710 has an enhanced mode intended to enable it to achieve up to 3.0 Gbps of throughput when communicating with other MxL3710 nodes in the same network. The MxL3710 is backward interoperable with any MoCA 1.0, 1.1 and 2.0 compliant devices.

The chip contains an integrated RF power amplifier, Tx/Rx switch functionality, low-noise amplifier (LNA), Full-Spectrum Capture analog-digital converter, MoCA PHY and MAC. Supported interfaces within the MxL3710 family include 2.5G SGMII and PCIe v2.1 (MxL3711). For MoCA adapters, a host-less version of the chip is also available. Available in an 8 mm x 8 mm QFN package, the MxL3710 is pin-compatible to MaxLinear's recently announced MoCA 2.0 bonded IC, the MxL3705.

More in CPE