Broadcom D3 Chipsets Support Fon Wi-Fi

Fon (www.fon.com) announced the industry's first Fon-ready Broadcom (www.broadcom.com) chipsets for DOCSIS 3.0 devices. Broadcom's DOCSIS 3.0-based system-on-a-chip (SoC) solutions now feature a software development kit (SDK) designed to enable manufacturers to ...

Fon (www.fon.com) announced the industry's first Fon-ready Broadcom (www.broadcom.com) chipsets for DOCSIS 3.0 devices. Broadcom's DOCSIS 3.0-based system-on-a-chip (SoC) solutions now feature a software development kit (SDK) designed to enable manufacturers to build Fon Wi-Fi functionality directly into CPE without any additional development.

Broadcom's cable modem manufacturer customers will receive the standard SDK with Fon software and other new features and fixes included. The SDK will allow manufacturers to customize new CPE and upgrade their installed base of products and meet the specific demands of customers, like ISPs, who want to deliver Fon as a feature in their routers, in less time.
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